Category:SiTime SiT8008

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A die shot (after metallization/ IC interconnect removal) of the digital die of the SiTime SiT8008, a programmable oscillator reaching quartz precision with high reliability and low g-sensitivity. The nanoscale transistors and nanoscale mechanical components (on a separate die) are integrated on the same chip package.^[1]
— English Wikipedia article “en:Nanoelectromechanical systems”

Footnote

↑ SiTime SiT8008 - MEMS oscillator : Weekend die-shot : ZeptoBars. (zeptobars.com)
" SiTime SiT8008 is a programmable MEMS oscillator reaching quartz precision but with higher reliability and lower g-sensitivity. Also SiTime is one of companies who received investments from Rosnano - Russian high-tech investment fund.
Photo of MEMS die puzzled us for quite some time. Is it some sort of integrated SAW/STW resonator?
The trick is that to reach maximum Q-factor (up to ~186'000 according to patents) MEMS resonator must operate in vacuum. So they package resonator _inside_ the die in hydrogen atmosphere, then anneal it in vacuum so that hydrogen escapes through silicon. So we see here only a cap with contacts to "buried" MEMS resonator. We were unable to reach the resonator itself without x-ray camera or ion mill.
MEMS die size - 457x454 µm.
Thankfully relevant patents were specified right on the die : US6936491 US7514283 US7075160 US7750758 :) "
.

Media in category "SiTime SiT8008"

The following 5 files are in this category, out of 5 total.

SiT8008-die-HD.jpg 3,432 × 3,828; 11.49 MB
SiT8008-logo.jpg 400 × 255; 90 KB
SiT8008-resonator-HD.jpg 2,220 × 2,216; 2.94 MB
SiT8008-Si-HD.jpg 3,409 × 3,817; 11.81 MB
SiT8008-stdcells.jpg 1,000 × 330; 314 KB

[1] SiTime SiT8008 - MEMS oscillator : Weekend die-shot : ZeptoBars. (zeptobars.com)
" SiTime SiT8008 is a programmable MEMS oscillator reaching quartz precision but with higher reliability and lower g-sensitivity. Also SiTime is one of companies who received investments from Rosnano - Russian high-tech investment fund.
Photo of MEMS die puzzled us for quite some time. Is it some sort of integrated SAW/STW resonator?
The trick is that to reach maximum Q-factor (up to ~186'000 according to patents) MEMS resonator must operate in vacuum. So they package resonator _inside_ the die in hydrogen atmosphere, then anneal it in vacuum so that hydrogen escapes through silicon. So we see here only a cap with contacts to "buried" MEMS resonator. We were unable to reach the resonator itself without x-ray camera or ion mill.
MEMS die size - 457x454 µm.
Thankfully relevant patents were specified right on the die : US6936491 US7514283 US7075160 US7750758 :) "
.

[1]

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