File:VIA QSM-8Q90 Module - Module Angle (6856346650).jpg

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English: With advantages of its compact size, integrated thermal solution and low cost connectors, VIA QSeven is the ideal building block for various low power and handheld applications. Seen here from an angle.
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Source https://www.flickr.com/photos/viagallery/6856346650/
Author VIA Gallery

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This file is licensed under the Creative Commons Attribution 2.0 Generic license.
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This image was originally posted to Flickr by viagallery.com at https://www.flickr.com/photos/15932083@N05/6856346650. It was reviewed on 15 March 2015 by FlickreviewR and was confirmed to be licensed under the terms of the cc-by-2.0.

15 March 2015

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Date/TimeThumbnailDimensionsUserComment
current04:51, 15 March 2015Thumbnail for version as of 04:51, 15 March 20152,124 × 1,990 (1.02 MB)Kai Tak (talk | contribs)Transferred from Flickr via Flickr2Commons

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