Category:Lithography (microfabrication)
Wikimedia category | |||||
Upload media | |||||
Instance of | |||||
---|---|---|---|---|---|
| |||||
![]() |
Subcategories
This category has the following 8 subcategories, out of 8 total.
A
D
E
- Electron beam microlithography (28 F)
- Extreme ultraviolet lithography (101 F)
M
- Microlithography (14 F)
- Multiple patterning (175 F)
N
- Nanoimprint lithography (21 F)
P
Media in category "Lithography (microfabrication)"
The following 114 files are in this category, out of 114 total.
-
16 nm hp Patterning Cost Comparison.png 751 × 288; 13 KB
-
193i continuation.PNG 621 × 442; 20 KB
-
1D SADP single mask.png 330 × 262; 1 KB
-
1st order obscuration.png 658 × 692; 24 KB
-
1x nm hp double patterned cuts.png 360 × 485; 10 KB
-
26 nm pitch vs 52 nm pitch with obscuration.png 811 × 361; 48 KB
-
27 nm pitch cut patterning.png 241 × 441; 4 KB
-
36 nm pitch 2-bar CD delta vs focus.png 481 × 288; 8 KB
-
36 nm pitch vertical line T2T.png 478 × 296; 9 KB
-
7nm node metal pattern shifts through EUV focus.png 514 × 267; 11 KB
-
Assist feature OPC.png 482 × 290; 17 KB
-
Asymmetric 2D SAQP with LE2 block.png 601 × 378; 7 KB
-
Binary vs PSM NILS.png 481 × 289; 10 KB
-
Borodovsky challenge LELELE.png 451 × 262; 2 KB
-
CD 3s vs dose.png 589 × 384; 22 KB
-
CD sensitivity to multilayer buried defect.png 468 × 289; 7 KB
-
Contrast reduction vs photon noise.png 321 × 306; 51 KB
-
Converging number of cuts.png 482 × 295; 10 KB
-
Creating the PDMS master.svg 392 × 567; 4 KB
-
Cut exposure reduction.png 1,030 × 361; 150 KB
-
Cut overlay issues.png 441 × 393; 11 KB
-
Defocus of subresolution assist features.png 654 × 288; 19 KB
-
Defocus pattern shift vs wavelength.png 591 × 297; 20 KB
-
Depth-of-focus.JPG 417 × 251; 15 KB
-
Different illumination angles different images.png 613 × 487; 303 KB
-
DUV vs EUV line edge variability.png 1,126 × 236; 55 KB
-
EUV 2D edge stochastic variability.png 564 × 274; 272 KB
-
EUV contact-to-contact area variation.png 767 × 481; 49 KB
-
EUV dose increase for smaller size.png 492 × 292; 10 KB
-
EUV High-NA stochastic sidelobes.png 480 × 289; 16 KB
-
EUV mask defect printability.png 525 × 264; 25 KB
-
EUV stochastic EPE.png 559 × 288; 17 KB
-
EUV Stochastic Hot Spots.png 309 × 289; 42 KB
-
EUV vs DUV image shot noise.png 480 × 157; 27 KB
-
EUVL printable defects.png 593 × 289; 13 KB
-
EVG 120 resist coater-developer at LAAS 0434.jpg 3,872 × 2,592; 4.24 MB
-
Extended double patterning.PNG 621 × 385; 12 KB
-
Feature stitching across fields.png 409 × 233; 6 KB
-
FIB Microhole Arrays.tif 1,280 × 960; 1.19 MB
-
Fotolitograafia.png 360 × 480; 17 KB
-
H and V shadowing across EUV slit.png 565 × 263; 16 KB
-
High-NA EUV forbidden illumination combinations.png 387 × 354; 30 KB
-
Honeycomb structure patterning.png 424 × 384; 12 KB
-
Image shift vs illumination pole.png 1,129 × 606; 67 KB
-
Impact of electron spread function.png 625 × 289; 17 KB
-
Inking and Contact Process.JPG 478 × 580; 28 KB
-
Inking and contact process.svg 403 × 580; 4 KB
-
LIGA-Process-00.png 1,183 × 3,224; 508 KB
-
Litografia elettronica.jpg 1,055 × 313; 28 KB
-
LitRo3.jpg 467 × 340; 31 KB
-
LitRo4.jpg 391 × 340; 16 KB
-
LitRo5.jpg 562 × 340; 29 KB
-
LitRo6.jpg 556 × 340; 28 KB
-
Lower vs higher blur stochastics.png 1,157 × 330; 53 KB
-
Macrotimbre 2.png 906 × 710; 1.35 MB
-
Magnetic field assisted micro contact printing.png 1,352 × 713; 53 KB
-
Mask-assisted spacer self-trimming.png 1,177 × 287; 10 KB
-
Microfabrication NFP.tif 338 × 561; 44 KB
-
Microfabrication of Nanofountain probe.svg 338 × 561; 27 KB
-
Micropatterns-fibronectin-glass.png 848 × 694; 181 KB
-
Micropatterns-fibronectin-glass.tif 848 × 694; 575 KB
-
Multipatterning-friendly layout.png 532 × 296; 7 KB
-
Nanoimprint proximity effect.jpeg 643 × 512; 32 KB
-
Nanojäljendlitograafia.jpg 620 × 780; 53 KB
-
Nanosize 3D model of a vintage ZEISS microscope, by Nanoscribe (29829841445).jpg 1,457 × 970; 206 KB
-
Node progress.png 1,571 × 313; 27 KB
-
Non-telecentricity.png 817 × 499; 49 KB
-
NXE3400 TPT vs dose.png 480 × 289; 9 KB
-
Optical proximity correction.png 518 × 762; 4 KB
-
Outgassing contamination vs dose.png 454 × 279; 13 KB
-
Overview 3.jpg 767 × 576; 84 KB
-
P28 dipole leaf image fading.png 481 × 289; 18 KB
-
PDMS stamp defect.svg 774 × 209; 1 KB
-
PDMS stamp defects.JPG 774 × 209; 12 KB
-
Pellicle Mounting Machine MLI.jpg 425 × 319; 49 KB
-
Photoelectron trajectories vs dose.png 1,003 × 224; 21 KB
-
Photolithography 2.JPG 534 × 436; 30 KB
-
Photoresist spin-coaters at LAAS 0448.jpg 3,872 × 2,592; 3.54 MB
-
Projected cost trend of SADP.png 481 × 289; 8 KB
-
Protocol for magnetic stamp.png 1,445 × 879; 73 KB
-
SAQP flow for SAB.png 1,166 × 1,089; 24 KB
-
SAQP over SADP.png 432 × 232; 17 KB
-
Scattered light from phase defect.JPG 442 × 309; 28 KB
-
Screenshot 20230216 130758 PowerPoint.jpg 1,464 × 1,063; 185 KB
-
Secondary electron depth in resist.png 481 × 289; 9 KB
-
Secondary Electrons from Layers under EUV Resist.png 1,403 × 333; 88 KB
-
Self-aligned via patterning.png 990 × 309; 16 KB
-
Self-trimming with isotropic etch.png 391 × 465; 7 KB
-
Shot noise CD variation.png 424 × 442; 20 KB
-
SID-SIM-SID SAQP LE Asymmetric.png 601 × 378; 7 KB
-
Sidewall profile modulation.png 1,120 × 399; 27 KB
-
Single-mask SID SADP.png 332 × 291; 4 KB
-
Soft lithography proc 1.jpg 570 × 331; 23 KB
-
Soft lithography proc 2.jpg 575 × 323; 22 KB
-
Soft lithography proc1.svg 600 × 335; 3 KB
-
Soft lithography proc2.svg 600 × 335; 4 KB
-
Sorg impatto elettronico.jpg 674 × 417; 20 KB
-
Spectrum of lithography lights.PNG 1,150 × 350; 104 KB
-
Spin-coater for resist coating (DE).svg 800 × 600; 23 KB
-
Spinner.jpg 641 × 823; 63 KB
-
Spread of electrons outside EUV exposure area.png 662 × 528; 328 KB
-
StencilLithography.jpg 942 × 179; 19 KB
-
Stitch Double Patterning.png 865 × 398; 8 KB
-
Stochastic overlay.png 701 × 356; 87 KB
-
Strukturbreiten (Prozessoren) über Zeit EN.svg 4,557 × 1,481; 24 KB
-
Strukturbreiten über Zeit DE.svg 4,557 × 1,481; 24 KB
-
Sub-0.5 k1 brick pattern.png 372 × 267; 29 KB
-
Thermal polymer decomp.tiff 656 × 245; 27 KB
-
Undersized contact.png 210 × 607; 85 KB
-
Via Triple Patterning for EUV.png 211 × 444; 7 KB
-
Wafertraksystem.jpg 2,048 × 1,536; 577 KB
-
Wavelength dependence of shot noise.png 620 × 515; 27 KB
-
Wider T2T SID.png 345 × 404; 5 KB
-
Write erase bit.tiff 404 × 182; 22 KB