Dual inline packages

English: In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board (PCB).

Drawings of DIP

8 Pins

• 
  Shaded
• 
  Unshaded
• 
  Labeled as an NE555 timer

14 Pins

• 
  Shaded
• 
  Unshaded
• 
  Labeled with a part number

16 Pins

• 
  Shaded
• 
  Unshaded
• 
  Labelled with a part number

Photos of DIPs alone

• 
  A selection of CMOS logic chips (4016, quad bilateral switches)
• 
  An early 1Mb memory chip
• 
  A selection of op-amps in DIPs
• 
  UV erasable, DIP28

Photos of DIPs in situ

• 
  4 Mb memory board from a VAX 8600
• 
  Intel 4004 in situ