File:Chemical-mechanical polishing (CMP-108, conditioner).jpg
Size of this preview: 800 × 600 pixels. Other resolutions: 320 × 240 pixels | 640 × 480 pixels | 1,024 × 768 pixels.
Original file (1,024 × 768 pixels, file size: 359 KB, MIME type: image/jpeg)
Captions
Captions
Add a one-line explanation of what this file represents
| Description |
English: Pad conditioner (Chiaping model 108) for the chemical-mechanical polishing (CMP), which removes material from uneven topography on a wafer surface until a flat surface is created.
Deutsch: Pad-Konditioner (Chiaping Modell 108) für das chemisch-mechanische Polieren (CMP), CMP entfernt Material auf einer Wafer-Oberfläche und glättet somit eine unebenen Topographie. |
| Date | |
| Source | CMP-108 |
| Author | cpxmn |
See description under [1]
Licensing
edit.jpg&action=edit§ion=1){kind=link}
This file is licensed under the Creative Commons Attribution-Share Alike 2.0 Generic license.
- You are free:
- to share – to copy, distribute and transmit the work
- to remix – to adapt the work
- Under the following conditions:
- attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
- share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.
|
This image was originally posted to Flickr by cpxmn at https://www.flickr.com/photos/22041495@N02/2126608662. It was reviewed on 12 April 2010 by FlickreviewR and was confirmed to be licensed under the terms of the cc-by-sa-2.0. |
File history
Click on a date/time to view the file as it appeared at that time.
| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 15:53, 12 April 2010 | | 1,024 × 768 (359 KB) | Cepheiden (talk | contribs) | {{Information |Description={{en|CMP CHEMICAL MECHANICAL POLISHING removes material from uneven topography on a wafer surface until a flat surface is created.}} |Source=[http://www.flickr.com/photos/22041495@N02/2126608662/ CMP-108] |Date=2005-08-25 14:10 |
You cannot overwrite this file.
File usage on Commons
There are no pages that use this file.
File usage on other wikis
The following other wikis use this file:
- Usage on de.wikipedia.org
.jpg&oldid=855375290){kind=link}