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File:Cudeposition.gif

Cudeposition.gif(320 × 380 pixels, file size: 669 KB, MIME type: image/gif, looped, 187 frames, 19 s)

SummaryEdit

Description

Molecular dynamics computer simulation of the deposition of a single copper atom with a kinetic energy of 1 eV on a copper surface. Technical details: cross section of two atom layers in the middle of a larger (10x10x10 unit cells) 3D simulation cell. Simulation made with Sabochick-Lam embedded-atom method potential, Berendsen temperature control used only at the outer boundaries to scale temperature down to 0 K. Initial temperature 0 K (cell prerelaxed to allow for surface relaxation inwards). This kind of processes occur in reality during physical vapour deposition.

Date
Source Own work
Author Knordlun

LicensingEdit

Public domain This work has been released into the public domain by its author, I, Knordlun. This applies worldwide.
In some countries this may not be legally possible; if so:
I, Knordlun grants anyone the right to use this work for any purpose, without any conditions, unless such conditions are required by law.

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Date/TimeThumbnailDimensionsUserComment
current12:39, 30 July 2007Thumbnail for version as of 12:39, 30 July 2007320 × 380 (669 KB)Knordlun (talk | contribs){{Information |Description=Molecular dynamics computer simulation of the deposition of a single copper atom on a copper surface. Technical details: cross section of two atom layers in the middle of a larger 3D simulation cell. Simulation made with Sabochi
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