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File:Leiterbahn ausfallort elektromigration02.jpg

Leiterbahn_ausfallort_elektromigration02.jpg ‎(512 × 512 pixels, file size: 65 KB, MIME type: image/jpeg)

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Deutsch: Aufnahme eines Ausfallortes verursacht durch Elektromigration in einer Kupferleiterbahn unter dem Rasterelektronenmikroskop. Die Passivierung wurde vorher durch Reactive Ion Etching (RIE) und Fluorwasserstoffsäure (HF) entfernt. Die Ätzprozesse sind dabei nicht erprobt gewesen und beruhen auf Versuchen das best mögliche Resultat zu erlangen.
Date 21 April 2004 (original upload date)
Source selbst mit dem Rasterelektronenmikroskop aufgenommen
Author Patrick-Emil Zörner

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GNU head Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled GNU Free Documentation License.
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  • 2004-04-21 15:47 Paddy 512×512× (66126 bytes)

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current20:21, 6 December 2010Thumbnail for version as of 20:21, 6 December 2010512 × 512 (65 KB)File Upload Bot (Magnus Manske) (talk | contribs) {{BotMoveToCommons|de.wikipedia|year={{subst:CURRENTYEAR}}|month={{subst:CURRENTMONTHNAME}}|day={{subst:CURRENTDAY}}}} {{Information |Description={{de|Aufnahme eines Ausfallortes verursacht durch Elektromigration in einer Kupferleiterbahn unter dem Raste

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