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File:Pad Cratering 03.jpg

Pad_Cratering_03.jpg ‎(381 × 281 pixels, file size: 20 KB, MIME type: image/jpeg)

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Description
English: Crater left on printed circuit board after copper pad from BGA connection has been pulled away.
Date
Source Integral Technology, Lake Forest, CA
Author Chris Hunrath

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Date/TimeThumbnailDimensionsUserComment
current00:39, 9 November 2010Thumbnail for version as of 00:39, 9 November 2010381 × 281 (20 KB)Rockyh2 (talk | contribs){{Information |Description={{en|1=Crater left on printed circuit board after copper pad from BGA connection has been pulled away.}} |Source=Integral Technology, Lake Forest, CA |Author=Chris Hunrath |Date=2010-08-01 |Permission= |other_versions= }}

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