File:Thermal CompoundApplying.JPG
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Summary edit
| Description |
English: Application of thermal grease (thermal compound) directly on the die of some Intel mobile CPU. |
| Date | |
| Source | Transferred from ml.wikipedia; transferred to Commons by User:Sreejithk2000 using CommonsHelper. |
| Author | Jyothis at ml.wikipedia |
| Permission (Reusing this file) |
CC-BY-SA-3.0. |
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Jyothis at ml.wikipedia, the copyright holder of this work, hereby publishes it under the following license:
This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Unported license.
Attribution: Jyothis at ml.wikipedia
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Original upload log edit
The original description page was here. All following user names refer to ml.wikipedia.
- 2008-09-28 12:42 Jyothis 2592×1944× (1955459 bytes) To replace the thermal compound deleted photos
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 05:09, 19 November 2010 | | 2,592 × 1,944 (1.86 MB) | File Upload Bot (Magnus Manske) (talk | contribs) | {{BotMoveToCommons|ml.wikipedia|year={{subst:CURRENTYEAR}}|month={{subst:CURRENTMONTHNAME}}|day={{subst:CURRENTDAY}}}} {{Information |Description={{ml|To replace the thermal compound deleted photos}} |Source=Transferred from [http://ml.wikipedia.org ml.w |
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